AI & Semiconductor
Thermal and EMI solutions for high-performance computing
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HQ KOREA
+82-31-495-2601
info@joinset.com
Thermal Management & EMI Shielding for AI, Data Infrastructure & Semiconductor Systems
AI servers, GPU accelerators, high-speed memory, optical modules, data center equipment and semiconductor manufacturing systems are becoming denser, faster and hotter. As compute power rises, design teams must manage heat concentration, high-speed signal noise, board-level EMI and long-duty system reliability.
JOINSET can support AI and semiconductor-related electronics with thermal gap pads, gap fillers, EMI absorbers, SMD EMI gaskets and ceramic passive components for systems where thermal transfer and EMI control are part of the same design environment.
AI & Semiconductor design requirements
Heat concentration around high-power devices
GPUs, accelerators, CPUs, optical modules and power devices can generate concentrated thermal loads that require stable interface materials and controlled thickness.
High-speed EMI and signal integrity
Fast interfaces, dense PCBs, memory, optical transceivers and power conversion can create EMI and noise paths that require shielding, grounding and absorption.
Reliability over long duty cycles
AI infrastructure and semiconductor equipment often operate continuously. Thermal stability, outgassing control, material consistency and process repeatability matter.
Limited space and complex assembly
Server boards, modules and semiconductor equipment assemblies often need custom shapes, precise tolerances and material formats that fit existing mechanical designs.