Korea based · In-house R&D, Manufacturing and Quality Assurance
EMI Shielding,
Thermal Interface Materials
& Ceramic Components
Supporting customers across automotive, mobile, telecommunications, semiconductor, medical, industrial, and aerospace & defense industries.
Explore Products→24YrsIn business
250+Patents & IP rights
4.5Billion Pcs+Supplied annually
150+Customers worldwide
500+Employees
Products
EMI & RF Solutions
SMT EMI Gasket, EMI Gasket, EMI Absorber, FIPG, Conductive adhesive, Conductive fabric, tube, washer, sheet and tape for EMI/RF shielding, grounding and absorbing.
Thermal Solutions
Thermal Gap Pad, Thermal Gap Filler (Thermal Putty, Thermal Gel, Thermal Grease, Thermal Adhesive, Thermal sheet and tape) as that support heat transfer between electronic components and cooling heat sink.
Ceramic Components
Thermistor(NTC, PTC), Varistor, Specialty MLCC, Piezo, Zirconia for Electronic applications,
Accessory Components
SMT Mechanical Damper, SMT Mechanical Spacer, Metal stiffener, Metal pad and Application-specific components
R&D and Manufacturing
In-House.
From R&D to Production
Application EngineeringJOINSET R&D CENTER
JOINSET integrates material development, product development, application engineering, tooling, manufacturing, testing and quality assurance—all in-house. We support customers from initial design and prototyping through qualification and high-volume production.
From Development to Production
- 01
Material
Development - 02
Application
Engineering - 03
Manufacturing
- 04
Quality Assurance
Markets & Applications
Solution for Your Industry
Explore EMI shielding, thermal interface materials and ceramic components engineered for your industry.
Medical Devices
Consumer Electronics
Automotive & EV
AI & Semiconductor
Aerospace & Defense
5G & 6G Wireless
Mobile & Wearable
News
Announcement
Whitepaper
News